关键词:
MOSFET
Thermal characteristics
Soldering
Reinforcements
Titanium oxide
Reliability
Shear strength
TIO2 NANOPARTICLES ADDITION
MECHANICAL-PROPERTIES
MICROSTRUCTURE
ALLOY
摘要:
Purpose - This paper aims to investigate the influence of composite solder joint preparation on the thermal properties of metal-oxide-semiconductor field-effect transistors (MOSFETs) and the mechanical strength of the soldered joint. Design/methodology/approach - Reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO2) were prepared. The reference alloy was Sn99Ag0.3Cu0.7. Reinforced joints differed in the weight percentage of TiO2, ranging from 0.125 to 1.0 Wt.%. Two types of components were used for the tests. The resistor in the 0805 package was used for mechanical strength tests, where the component was soldered to the FR4 substrate. For thermal parameters measurements, a power element MOSFET in a TO-263 package was used, which was soldered to a metal core printed circuit board (PCB) substrate. Components were soldered in batch IR oven. Findings - Shear tests showed that the addition of titanium oxide does not significantly increase the resistance of the solder joint to mechanical damage. Titanium oxide addition was shown to not considerably influence the soldered joint's mechanical strength compared to reference samples when soldered in batch ovens. Thermal resistance Rthj-a of MOSFETs depends on TiO2 concentration in the composite solder joint reaching the minimum R-thj at 0.25 Wt.% of TiO2. Research limitations/implications - Mechanical strength: TiO2 reinforcement shows minimal impact on mechanical strength, suggesting altered liquidus temperature and microstructure, requiring further investigation. Thermal performance: thermal parameters vary with TiO2 concentration, with optimal performance at 0.25 Wt.%. Experimental validation is crucial for practical application. Experimental confirmation: validation of optimal concentrations is essential for accurate assessment and real-world application. Soldering method influence: batch oven soldering may affect mechanical strength, necessitating exploration of alternative methods. Ther